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Buried/Blind Via: 4-50 layers, board thickness 0.4mm-10mm
Material: Normal FR4(KB,ShengYi,NanYa,ITEQ,GuoJi)/Halogen Free/High Tg/Isona,Nelco,Ventec,Tuc,Elite,Getek,Panasonic...
Surface Treatment: Hasl/Lead Free Hasl/Peelable Soldermask/Carbon ink/OSP/ENIG/ENEPIG/Gold Finger/Immersion Tin
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